doc. no : qw0905-L8E5730 rev. : a date : 19 - jul. - 2007 data sheet L8E5730 rectangle type led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
note : 1.all dimension are in millimeter tolerance is ligitek electronics co.,ltd. property of ligitek only page 1/5 1.0min 25.0min 2.54typ 7.8
635 ligitek electronics co.,ltd. property of ligitek only unit ma mw " a ma orange symbol absolute maximum ratings parameter absolute maximum ratings at ta=25 # 50 50 i fp pd 10 ir power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f 15 page 2/5 # -40 ~ +100 tstg storage temperature forward voltage @10ma(v) color typical electrical & optical characteristics (ta=25 # ) luminous intensity @10ma(mcd) 8.0144 typ. min. min. 4.5 2.1 451.7 emittedlens orange orange diffused gaasp/gap L8E5730 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typ. peak wave length $ pnm spectral halfwidth %$ nm viewing angle 2 & 1/2 (deg) part nomaterial operating temperature -40 ~ +85 t opr # part no. L8E5730
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ligitek electronics co.,ltd. property of ligitek only 550 600 0.0 0.5 1.0 650 700750 8e chip page 3/5 part no. L8E5730
page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 260 ' temp( 100 50 preheat 120 ' 25 ' 0 0 ' note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. part no. L8E5730
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